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High frequency board and mixed pressure board

High frequency board and mixed pressure board PCB capability
High Frequency and Mixed Pressure Boards
High frequency board and mixed pressure board
Serial number project Content description Parameters or models
1 Rogers sheets RO3000 series Ro3003, Ro3006, Ro3010, Ro3035, Ro3203, Ro3206, Ro3210
2 Rogers sheets RO4000 series Ro4003C, Ro4350B, Ro4360, Ro4533, Ro4700, Ro4835
3 Rogers sheets RT5000 series RT5870, RT5880
4 Rogers sheets RT6000 series RT6002, RT6035, RT6006
5 Rogers PP tablets Semi-cured adhesive sheet Ro4403(4mil), Ro4450B(4mil), Ro4450F(4mil), RO3001(1.5mil)
6 Arlon sheet Yalong series Diclad, Cuclad, Isoclad, AD series, CLTE, etc.
7 Arlon PP tablets Semi-cured adhesive sheet 25FR 1080 (4mil), 25FR 2112 (6mil), Cuclad6700 (1.5mil)
8 Taconic Plate Taiconi series TLX, TLY, RF, TLC, TLG series, CER10, etc.
9 Taconic PP tablets Semi-cured adhesive sheet TP-32 (4mil), TPG series (4mil), HT1.5 (1.5mil)
10 Wangling board Wangling F4BK, F4BM, F4B, TP-1/2, TF-1/2, CT330, CT350, CT440, CT615
11 Finished copper thickness oz 0.5oZ - 2oZ
12 Substrate copper foil oz 0.5oz - 1oZ
13 Maximum finished size RO3000 series 590*440mm (single and double), 580*420mm (multi-layer)
13 Maximum finished size RO4000 series 1200*430mm (single and double), 880*600mm (multi-layer)
13 Maximum finished size RT5000 series 590*440mm (single and double), 580*420mm (multi-layer)
13 Maximum finished size RT6000 series 590*440mm (single and double), 580*420mm (multi-layer)
13 Maximum finished size F4BM series 1480*430mm (single and double)
13 Maximum finished size TP/TF series 180mm*180mm (single and double)
13 Maximum finished size CT series 1200*430mm (single and double), 880*600mm (multi-layer)
14 Minimum finished size All materials 0.5*1.0mm
15 Maximum number of layers NaN 1-32 floors
16 Number of high frequency mixing layers NaN 4-32 floors
17 Material mixing type Rogers/Taconic/Arlon/Wangling and FR-4
18 Thinnest core board thickness Mil 4mil
19 Maximum size of PTFE high frequency\nboard imposition (thickness < 0.50mm) Unit: mm 16*18
20 Finished plate thickness Unit: mm 0.13-8.0mm (double-sided board) 0.4 -8.0mm (multi-layer board)
NaN Minimum drilling of PTFE material plate Unit: mm 0.35
21 Dielectric constant scope 1-25
22 Substrate thickness tolerance Unit: mm ±0.05mm
23 Complete plate thickness tolerance Unit: mm Plate thickness <1.0mm: +0.1, Plate thickness >1.0mm: +10%
24 Minimum line width tolerance Unit:um ±20um
25 Minimum line width and line spacing Unit: mm 0.076mm

Double-sided multilayer circuit board

Double-sided multilayer circuit board PCB capability
Double-sided Multilayer Circuit Board Data

Double-sided Multilayer Circuit Board Data

Double-sided multilayer circuit board
serial numbel project Content description Parameters or models
1 Number of layers layer 1-70
2 Material brand name Shengyi (SY), Lianmao (ITEQ), Kingboard (KB), Nanya (NOUYA)
3 surface treatment NaN Lead-free spray tin, immersion gold, OSP, immersion tin, immersion silver, gold plating, tinplating, nickel-palladium gold
4 selective surface treatment NaN ENIG+OSP, ENIG+G/F, full plate gold plating+G/F, immersed silver+G/F, immersed tin+G/F
5 Solder mask ink color NaN Green, yellow, black, sub-black, blue, red, white, sub-green
6 Character ink color NaN white, yellow, black
7 Maximum finished size of double-sided panels Unit: mm 2000*500
8 Maximum finished size of four- and six layer boards Unit: mm 570*850 or 1150*430 (long side exceeding 570MM requires review)
9 Maximum finished size of boards witheight layers and above Unit: mm 570*670 or 980*430 (long side exceeding 570MM requires review)
10 smallest size Unit: mm 0.5*1.0mm (thickness 0.5mm), 1.0*2.0mm (thickness > 0.5mm)
11 Minimum external dimension tolerance Unit: mm +0.05mm (laser molding), +0.1mm (mechanical molding)
12 Producible plate thickness range Unit: mm 0.13-8mm
13 Double panel thickness range Unit: mm 0.13-3.6mm
14 4 layer board thickness range Unit: mm 0.30-7mm
15 Thickness range of 6-layer boards and above Unit: mm 0.6-8mm (6 layers), 0.8-8mm (8 layers), 1.0-8mm (10 layers), 1.0-8mm (12 layers)
16 Plate thickness tolerance Unit: mm +0.1mm (thickness s 1.0mm), +10%mm (thickness > 1.0mm)
17 Minimum drilling capacity Unit: mm 0.075-0.1mm (laser), 0.15mm (mechanical)
18 Maximum drilling per time Unit; mm 6.5mm (drill bit)
19 Maximum drilling capacity Unit; mm 50mm (expanded hole, gong hole)
20 PTH minimum hole diameter tolerance Unit; mm +0.05mm (press hole), +0.075mm
21 NPTH minimum hole diameter tolerance Unit; mm +0.05mm (limit +0,-0.05mm or +0.05, -0mm)
22 Minimum hole position tolerance Unit; mm +0.075mm
23 Expansion hole tolerance Unit; mm +0.1mm
24 Slot diameter range Unit; mm 0.5-6mm
25 Minimum slot length Unit; mm 1.0mm
26 Slot aspect ratio Unit; mm 1:02
27 Minimum tolerance for milling slots Unit; mm Groove width and groove length are +0.15mm
28 Minimum tolerance for drilling slots Unit; mm +0.10 in groove width direction, +0.15 in groove length direction
29 Horn hole (countersunk hole) angle and size Unit; mm Large hole 82, 90, 120 degrees, diameter 10mm
30 Step hole NaN PTH and NPTH, large hole angle 130 degrees, large hole diameter not greater than 6.3mm
31 Minimum line width and line spacing NaN 0.075mm/0.075mm
32 Line width tolerance Unit; mm +20um
33 Minimum pad Unit; mm 0.15mm
34 FR-4 prepreg Unit; mm 1,061,080,331,321,160,000
35 Production of multiple-pressed blind and buried via boards NaN Lamination on the same side < 5 times
36 Maximum drilling diameter of plate hole plug hole Unit; mm 0.4
37 Minimum thickness of inner layer board NaN 0.05 (non-buried blind hole board), 0.13 (with buried blind hole drilling)
38 The inner channel is the smallest Mil 3 (18um base copper), 4 (35um base copper), 23mil
39 Inner layer processing NaN browning
40 Minimum wire spacing in the inner layer(105um base copper, after compensation Mil 5
41 Minimum wire spacing in the inner layer(140um base copper, after compensation Mil 7
42 Minimum wire spacing in the inner layer(18um base copper, after compensation) Mil 3
43 Minimum wire spacing in the inner layer(35um base copper, after compensation) Mil 3.5
44 Minimum wire spacing in the inner layer(70um base copper, after compensation) Mil 4
45 Minimum wire width of inner layer (105umbase copper before compensation) Mil 5
46 Minimum wire width of inner layer (140umbase copper, before compensation) Mil 7
47 Minimum wire width of inner layer (18umbase copper before compensation) Mil 3
48 Minimum wire width of inner layer (35umbase copper, before compensation) Mil 3
49 Minimum wire width of inner layer (70um base copper before compensation) Mil 4
50 Minimum wire spacing on the outer layer105um base copper, after compensation) Mil 6
51 Minimum wire spacing in the outer layer(12, 18um base copper, after compensation) Mil 3.0(18um), 2.5(12um)
52 Minimum wire spacing on the outer layel (140um base copper, after compensation) Mil 7
53 Minimum wire spacing in the outer laye (35um base copper, after compensation) Mil 3.5
54 Minimum wire spacing in the outer laye(70um base copper, after compensation) Mil 5
55 Minimum wire width of outer layer(105um base copper, before compensation) Mil 8
56 Minimum wire width of outer layer (12, 8um base copper, before compensation) Mil 3.5(18um), 3(12um)
57 Minimum wire width of outer layel(140um base copper, before compensation) Mil 9
58 Minimum wire width of outer layer (35um base copper before compensation) Mil 4.5
59 Minimum wire width of outer layer (70um base copper before compensation) Mil 6
60 Minimum line-to-disk and disk-to-disc spacing of the outer layer (after compensation) Mil 3(12, 18um) 3.5(35um), 5(70um) 6(105, 140um)
61 Minimum line width and spacing of theouter layer of multiple (z2) electroplatedburied blind hole boards Mil 3.5/3.5 (before compensation)
62 he minimum distance between the edgesof the inner layer board without copper leakage Mil 10
63 The inner isolation bandwidth is the smallest Mil 8
64 The inner isolation ring width (single side) is the smallest Mil 8 (<6 layers), 10 (z8 layers) partial cutting disc can be 8
65 The inner pad has the smallest single side width (non-buried blind hole) Mil 4.5 (18, 35um, partial 4), 6 (70um), 8 (105um)
66 The inner pad has the smallest single side width (laser hole) Mil 3
67 Impedance tolerance % ± 5Ω(<50),+10%(2502);250 can be +5%(needs evaluation),
68 BGA pad diameter minimum Mil 7mil
69 Pad diameter minimum Mil 12 (0.10mm mechanical or laser drilling)
70 The copper thickness of the hole is the thinnest (non-buried blind hole) um Average 25, minimum single point > 20
71 The copper thickness of the hole is the thinnest (buried hole, blind hole) um Average 20, minimum single point 2 18
72 Insulation layer thickness (minimum) um 0.075 (HOZ bottom copper only)
73 Electroless nickel gold gold thickness um 0.025-0.10
74 Electroless nickel gold nickel thickness um 3-5
75 Chemical immersion silver silver thickness um 0.1-0.3
76 Lead-free lead tin/pure tin minimum thickness um 0.4 (large tin surface)
77 gold finger nickel plated gold thick um 0.25-1.3 (required value refers to the thinnest point)
78 Gold finger nickel plated gold nickel thickness um 3-5
79 Full plate nickel gold plated um 0.025-0.10
80 Gold finger chamfer angle tolerance NaN ±5°
81 Goldfinger chamfering thickness tolerance Mil ±5
82 Gold finger height is the largest Inch 2
83 Minimum distance between golden fingers Mil 6
84 The minimum distance between the TAB next to the golden finger without causing damage mm 7 (referring to automatic chamfering)
85 Long and short golden fingers NaN Can be combined with various surface treatments
86 Long and short gold finger surface treatment NaN Liquid gold/immersion gold; electroplated hard gold
87 Chemical immersion tin tin thickness um 0.8-1.5
88 Electroplated hard gold gold thickness um 0.15-1.3
89 Full plate nickel gold plated nickel thick um 3-5
90 0.10mm mechanical drilling maximum plate thickness mm 0.6
91 0.15mm mechanical drilling maximum plate thickness mm 1.2
92 0.25mm drill cutter maximum plate thickness mm 5
93 Warpage limit capability 0.75% 0.75 (<0.5 needs review)
94 Dry film sealing slot hole largest NaN 5mm*3.0mm; one side of the hole sealing is greater than 15mil
95 Minimum width of one side of dry film sealing Mil 10
96 Dry film sealing maximum diameter mm 4.5
97 Green oil window opening word width is the smallest Unit:mil 8
98 Green oil thickness is smallest Unit:um 10
99 Solder mask bridge minimum width Mil 3 (green), 5 (other colors) (base copper < 10Z) (base copper 2-40Z, all according to 6mil)
100 Minimum single side width of green oil cover line Mil 2.5 (local 2mil allowed)
101 Green oil minimum single-sided window opening (clearance) Mil 2 (water gold board can be partially 1.5, other boards can be partially 1)
102 Maximum drilling diameter of green oil plug hole (covered with oil on both sides) mm 0.65
103 Thickness of via cover oil um 5/8
104 V-CUT angle specifications NaN 20°,30°,45°,60°
105 The distance from the center line of V-CUT to the pattern without copper leakage (1.0<H<1.6mm) mm 0.36(20%,0.4(30°),0.5(45°, 0.6(60°)
106 The distance from the center line of V-CUT to the pattern without copper leakage (1.6<H<2.4mm) mm 0.42(20°,0.51(30°),0.64(45°,0.8(60%
107 The distance from the center line of V-CUT to the pattern without copper leakage (2.5<H<3.0mm) mm 0.47(20°),0.59(30°),0.77(45,0.97(60°)
108 The distance from the center line of V-CUT to the pattern without copper leakage (H<1.0mm) mm 0.3(20°),0.33(30°,0.37(45,0.42(60%)
109 V-CUT upper and lower offset tolerance Mil ≤4
110 V-CUT angle tolerance Spend ±5°
111 V-CUT residual thickness tolerance Mil ±4
112 Maximum diameter of blue glue white mesh plug hole mm 2
113 The minimum blue plastic cover line or pad on one side Mil 2
114 Maximum diameter of blue glue aluminum sheet plug hole mm 4.5
115 Minimum isolation between blue glue and solder pad Mil 12
116 The carbon oil cap line is the smallest on one side Mil 10
117 Minimum isolation between carbon oil and solder pad Mil 15
118 Minimum separation between carbon oil and carbon oil Mil 12
119 Minimum grid spacing Mil 5 (12, 18, 35 um), 8 (70 um)
120 Minimum grid line width Mil 5 (12, 18, 35 um), 10 (70 um)
121 Minimum character line width and height (12, 18um base copper) NaN Line width 4mil; height: 23mil
122 Minimum character line width and height (35um base copper) NaN Line width 5mil; height: 30mil
123 Minimum character line width and height (70um base copper) NaN Line width 6mil; height: 45mil
124 Minimum isolation between characters and pads Mil 6
125 Test on-resistance minimum ¦¸ 10
126 Minimum distance between test point and board edge mm 0.5
127 Maximum test current mA 200
128 Maximum test voltage V 250
129 WNH Mil 3.9
130 Test pad minimum Mil 3.9
131 Etch mark minimum width Mil 8(12, 18um), 10(35um), 12(70um)
132 Dimensional accuracy (edge to edge) Unit:mil ±4 (complex shapes and inner grooves with this requirement need to be reviewed
133 Minimum inner corner radius Unit:mm 0.4
134 Depth controlled groove milling (edge) or blind groove accuracy (NPTH) Unit:mm ±0.10
135 Special tolerance requirements for plate thickness (no interlayer structure requirements) mm <2.0 board can be +0.1; 2.0-3.0 board can be +0.15; 23.0 board can be +0.2
136 Maximum plate thickness drilling ratio NaN 20:1 (excluding tool diameter <0.2mm, greater than 12:1 requires evaluation)
137 Minimum hole diameter mm 0.45
138 Appearance NaN Milled profile; V-CUT; Bridge connection; Post mark hole
139 Minimum milling cutter diameter mm 0.6
140 Minimum overall distance from drilling to conductor (non-buried blind hole board) Mil 6(<8 layers), 8(<14 layers), 9(<28 layers)
141 Minimum overall distance from drilling to conductor (buried blind hole plate) Mil 9 (first pressing); 10 (second or third pressing)
142 Minimum body distance from laser drilling to conductor (1st and 2nd level HDI board) Mil 4 (12, 18um) can be partially 3.5, 4.5 (35um), 6 (70um), 8 (105um), 10 (140um)
143 Minimum width of outer via pad per side Mil 8
144 Minimum distance for outer milling without exposing copper Mil 100
145 Test insulation resistance maximum M¦¸ 0.38-5.0
146 Hole resistance test plate thickness limit mm min: 0.62mm, max is 0.25mm thicker than the test plate thickness
147 Bore Resistance Test Bore Diameter Limit mm ±≤1
148 ionic pollution ug/cm2 7.8
149 Copper wire peeling strength N/cm 6
150 Solder mask hardness H 6
151 Flame retardancy NaN 94V-0
152 RCC material NaN Copper foil 12, resin 65, 100um (55, 90um after lamination)
153 Blue glue thickness mm 0.2-0.5
154 Minimum carbon oil line width mm 0.5mm

HDI circuit board

HDI circuit board PCB capability
serial numberprojectContent descriptionnan
1Supporting materialsbrand nameShengyi (SY), Lianmao (ITEQ), Kingboard (KB), Nanya (NOUYA)
2HDI structure1+N+1, 2+N+2,3+N+3, 4+N+4, 5+N+5, 6+N+6, any layer
3structural orderN+N,N+X+N,1+(N+X+N)+1
4Number of layers that can be produced1-40 layers
5Minimum line width/spaceUnit:mil2/2
6Minimum mechanical holeUnit: mm0.15mm
7Minimum thickness of core boardUnit:mil2mil
8Laser hole diameterUnit: mm0.075mm- 0.1mm
9Minimum thickness of insulation layerUnit:mil2mil
10Maximum diameter of resin plug holeUnit: mm0.4mm
11Electroplating hole fillingCanCan
12Plating hole filling apertureUnit:mil3-5mil
13Hole stacked plate/hole stacked hole/plate plus hole (VOP)CanCan
14Minimum hole wall to line distanceUnit:mil7mil
15Laser hole accuracyUnit: mm0.025mm
16Minimum BGA pad center distanceUnit: mm0.3mm
17Minimum SMTUnit: mm0.25mm
18Electroplating hole filling concavityUnit:um≤10um
19Back drilling/controlled depth drilling tolerancesUnit: mm±0.05mm
20Through-hole plating through-hole capabilitiesProportion16:01:00
21Blind hole plating through hole capabilityProportion1.2:1
22BGA minimum padUnit: mm0.2
23Minimum buried hole diameter (mechanical drilling)Unit: mm0.2
24Minimum buried hole diameter (laser drilling)Unit: mm0.1
25Minimum blind hole diameter (laser drilling)Unit: mm0.1
26Minimum blind hole diameter (mechanical drilling)Unit: mm0.2
27Minimum spacing between laser blind vias and mechanical buried viasUnit: mm0.2
28Laser drilling hole diameter is smallestUnit: mm0.10 (depth
29Minimum BGA pad center distanceUnit: mm0.3
30Alignment between layersUnit: mm+0.05mm(+0.0027)

Rigid-flex PCB Capability

Rigid-Flex PCB
Serial numberProjectContent descriptionParameters or modelsnumber
1FPC main base materialbrand nameTaiflex (taiflex), Hongren (gracethw), Shengyi (SY), Songrun
2PCB materialbrand nameShengyi (SY), Lianmao (ITEQ), Kingboard (KB)
3MaterialMaterial namePI (polyimide), PET
4Covering filmbrand nameTaiflex (taiflex), Hongren (gracethw), Shengyi (SY)
5Maximum number of layerslayer1-14 layers (sample), 1-12 layers (batch)
6Finished plate thicknessUnit: mm0.25-3.0mm (sample) Rigid-soft board 0.25-3.0mm
7Minimum line width and line spacingUnit: mm0.05mm/0.05mm
8Maximum finished sizeUnit: mm230*450mm
9Finished product thickness toleranceUnit:um±50um
10Insulation layer thicknessUnit:um12.5um, 25um, 50um
11Copper foil thicknessUnit:um12um, 18um, 36um, 70um
12Reinforcement materialstypeFR4/PI/PET/SUS/PSA
13surface treatmenttypeImmersed gold, immersed tin, OSP, immersed silver, gold plating
14Minimum drilling hole diameterUnit: mmMechanical drilling: 0.15mm, laser drilling 0.1mm
15Through hole toleranceUnit: mmNPTH:+0.05mm,PTH:+0.075mm
16Covering film colortypeyellow, black
17PI thicknessUnit:mil0.5mil, 0.7mil, 0.8mil, 1mil, 2mil
18Maximum number of layers of soft board1-8 floors
19Minimum finished sizeUnit: mm5mm*8mm
20Minimum welding ringUnit: mmInner layer (5mil), outer layer (4mil)
21Reinforce minimum sizeUnit: mm+0.075mm
22Reinforce maximum sizeUnit: mm0.6x0.6mm (steel mold processing), 0.5x0.5mm (fine punching mold processing)
23Enhanced alignment accuracyUnit: mm0.5mm (precision mold), 0.2mm (laser engraving), 0.15mm (ordinary drilling)
24Cover the minimum window sizeUnit: mmNormal 0.08-0.12mm, extreme 0.03mm (TPX pressing)
25Minimum window spacing of covering filmUnit: mm0.5mm (precision mold), 0.2mm (laser engraving), 0.15mm (ordinary drilling)
26Amount of glue overflow from covering film (single side)Unit: mmNormal 0.08-0.12mm, extreme 0.03mm (TPX pressing)
27Minimum diameter of gold finger semicircular holeUnit: mm0.25mm, normal value 0.3mm
28Soft-hard composite board: anti-peel strengthN1.4N
29Rigid-soft board: flatnessumThe front of the furnace is less than 15UM, and the back of the furnace is less than 30UM.
30Rigid-soft board: Thermal shock¡æ288°C (3 times in 10 seconds)
31Soft-hard board: W/B gold wire tensiongramMore than 6 grams
32Rigid-soft board: minimum board thicknessUnit: mmSoft board 0.1mm, four layers 0.3mm, six layers 0.5mm, eight layers 0.6mm, 10 layers 0.8mm